Modular triad wafer design with 4 triad configurations and high-speed differential pairs (in both 85 and 100 Ohm impedance), high-speed single-ended traces, low-speed single-ended lines and power contacts:
Provides a customized system for design flexibility

High-speed triad wafers comprise 3 pins per differential pair (2 signal pins and 1 shielded ground pin):
Provide stand-alone 56 Gbps fully shielded differential pairs with dedicated grounds

Mirror-image triad layout enables the PCB routing in 1 or 2 layers for 4- and 6-row housings respectively:
Provides ease in PCB routing and lowers overall system costs by decreasing the number of PCB layers required for signal routing

Available in 12.00 to 40.00mm stack heights, circuit sizes of 24 to 120 triad wafers in 4 and 6 rows and 85 or 100 Ohm impedance:
Provides design flexibility

Innovative PCB connection using patented Solder Charge Technology:
Proven surface mount technology (SMT) attachment method for highly reliable and robust solder joints

Housing design based on honeycomb construction:
Isolates each differential pair for optimal performance and customization

Connectors have a density of 82 differential pairs per square inch:
Offers ultra-high-density signal solution with optimal signal integrity performance

Tombstone structures incorporated within the receptacle housing:
Prevents terminal damage by protecting the mating contact interface

Reliable mating interface with 2.00mm wipe:
Gives sufficient conductive wipe for clean signal transmission and enhanced performance

Durable housing material:
Delivers a robust system with mechanical stability