![462070010 - 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray](/content/dam/molex/molex-dot-com/products/manual/en-us/images/462/46207/0462070010_hires.jpg/_jcr_content/renditions/image-320.jpeg)
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Product Specification
Product Environment Compliance
GADSL/IMDS | Not Relevant |
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China RoHS: | ![]() |
EU ELV: | Not Relevant |
Low-Halogen Status: | Low-Halogen per IEC 61249-2-21 |
REACH SVHC: | Not Contained per D(2023)8585-DC (23 Jan 2024) |
EU RoHS: | Compliant per EU 2015/863 |
- Eu RoHS
- REACH SVHC
- Low-Halogen
- IPC 1752A Class C
- IPC 1752A Class D
- Molex Product Compliance Declaration
- IEC-62474
- chemSHERPA (xml)
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General
Status | Active |
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Category | PCB Headers and Receptacles |
Series | 46207 |
Description | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray |
Application | Board-to-Board, Power, Wire-to-Board |
Comments | Current for wire-to-wire applications = 13.0A max. per circuit; Current for wire-to-board applications = 9.0A max. per circuit |
Component Type | PCB Header |
Product Family | Mini-Fit Family Power Connectors |
Product Name | Mini-Fit Jr. |
UPC | 800756675787 |
Status | Active | Category | PCB Headers and Receptacles |
---|---|---|---|
Series | 46207 | Description | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating, Glow-Wire Capable, Tray |
Application | Board-to-Board, Power, Wire-to-Board | Comments | Current for wire-to-wire applications = 13.0A max. per circuit; Current for wire-to-board applications = 9.0A max. per circuit |
Component Type | PCB Header | Product Family | Mini-Fit Family Power Connectors |
Product Name | Mini-Fit Jr. | UPC | 800756675787 |
Electrical
Current - Maximum per Contact | 13.0A |
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Voltage - Maximum | 600V AC (RMS)/DC |
Current - Maximum per Contact | 13.0A | Voltage - Maximum | 600V AC (RMS)/DC |
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Physical
Breakaway | No |
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Circuits (Loaded) | 10 |
Circuits (maximum) | 10 |
Color - Resin | Black |
Durability (mating cycles max) | 100 |
First Mate / Last Break | No |
Flammability | 94V-0 |
Glow-Wire Capable | Yes |
Guide to Mating Part | No |
Lock to Mating Part | Yes |
Material - Metal | Brass |
Material - Plating Mating | Matte Tin |
Material - Plating Termination | Matte Tin |
Material - Resin | High Temperature Thermoplastic |
Net Weight | 3.621/g |
Number of Rows | 2 |
Orientation | Vertical |
Packaging Type | Tray |
PC Tail Length | 3.66mm |
PCB Locator | Yes |
PCB Retention | Yes |
PCB Thickness - Recommended | 1.57mm |
Pitch - Mating Interface | 4.20mm |
Pitch - Termination Interface | 4.20mm |
Polarized to Mating Part | Yes |
Polarized to PCB | Yes |
Shrouded | Fully |
Stackable | No |
Temperature Range - Operating | -40° to +105°C |
Termination Interface Style | Through Hole |
Breakaway | No | Circuits (Loaded) | 10 |
---|---|---|---|
Circuits (maximum) | 10 | Color - Resin | Black |
Durability (mating cycles max) | 100 | First Mate / Last Break | No |
Flammability | 94V-0 | Glow-Wire Capable | Yes |
Guide to Mating Part | No | Lock to Mating Part | Yes |
Material - Metal | Brass | Material - Plating Mating | Matte Tin |
Material - Plating Termination | Matte Tin | Material - Resin | High Temperature Thermoplastic |
Net Weight | 3.621/g | Number of Rows | 2 |
Orientation | Vertical | Packaging Type | Tray |
PC Tail Length | 3.66mm | PCB Locator | Yes |
PCB Retention | Yes | PCB Thickness - Recommended | 1.57mm |
Pitch - Mating Interface | 4.20mm | Pitch - Termination Interface | 4.20mm |
Polarized to Mating Part | Yes | Polarized to PCB | Yes |
Shrouded | Fully | Stackable | No |
Temperature Range - Operating | -40° to +105°C | Termination Interface Style | Through Hole |
Solder Process Data
Max-Duration | 30 |
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Lead-Free Process Capability | SMC&WAVE |
Max-Cycle | 3 |
Max-Temp | 265 |
Max-Duration | 30 | Lead-Free Process Capability | SMC&WAVE |
---|---|---|---|
Max-Cycle | 3 | Max-Temp | 265 |